Virginia Tech Facilities
Faculty Research Labs
- Multifunctional Integrated Circuits and Systems (MICS) Group
- PI: Yang “Cindy” Yi, Ph.D., Jeffrey Walling, Ph.D.
- Advanced Devices & Sustainable Energy Laboratory
- PI: Mantu K. Hudait, Ph.D.
- VT MEMS Lab
- PI: Masoud Agah, Ph.D.
Core Capabilities and Equipment
- Institute for Advanced Computing Academic Building One: BRICCS Lab in Alexandria, VA
- MPI TS2000-IFE Series | 200 mm Automated Probe Systems
- DC-IV / DC-CV / Pulsed-IV applications
- Silicon photonics
- RF, mmW, load-pull applications & 4-port setup
- IC Design Validation, Failure Analysis in wide tem-
- perature range from -60 to 300 °C
- Wafer Level Reliability
- Infiniium EXR-Series Real-Time Oscilloscope, 6 GHz, 16 GSa/s, 8 Channel
- Bandwidths of up to 500 MHz to 6 GHz on all 4 or 8 analog channels
- Powered by the same Keysight-designed ASICs used in the Infiniium UXR-Series
- Capabilities extended with 7-in-1 instrument integration: oscilloscope, logic and protocol analyzers, DVM, counter, bode plotter, waveform generator
- Completely upgradeable, including channel upgrades
- P9384B Vector network analyzer, 9kHz to 20GHz, 4 port, with Thunderbolt 3 Interface
- 4-port, 9 kHz to 20 GHz
- Balance performance and cost
- Improve throughput with fast Thunderbolt 3 interfaces
- Share the portable VNA with other teams and locations
- Extend the number of test ports by cascading two VNAs
- Measure with the same GUI, SCPI commands, and measurement science as Keysight’s trusted high-performance VNAs
- Calibrate quickly with Keysight Electronic Calibration (ECal) modules
- MPI TS2000-IFE Series | 200 mm Automated Probe Systems
- Nanoscale Characterization and Fabrication Lab in Blacksburg, VA
Accelerating Voltages: 100kV or 200kV
Current: 400 pA – 100 nA
Scan Speed: up to 125 MHz
Field Size High Resolution High Throughput
100kV 100 µm x 100 µm 1000 µm x 1000 µm
200kV 50 µm x 50 µm 500 µm x 500 µm
Stage Movement: 190 mm x 170 mm with 0.6 nm resolution
Minimum Line Width: 8 nm
Minimum Step Size: 0.5 nm
Overlay Accuracy: ±6 nm (actual, high throughput mode)
Field Stitching: ±16 nm (actual, high throughput mode)
Sample Size: up to 150 mm
- Whittemore Hall Clean Room
- Photolithography
Karl Suss MA-6/BA-6 Mask Aligner
OAI 800E Front and Backside Semiautomatic Mask Aligner
SF100 Maskless Photolithography System
- Thin Film Deposition
Kurt J Lesker PVD-250 E-beam Evaporator
Kurt J Lesker PVD-75 Sputtering System
- Chemical Vapor Deposition
- Etching
- Cleaning and Preparation
- Spin Coating
- Wafer Bonding
- Baking Ovens
Yield Engineering Services BCB and Polyimide Baking Oven
- Thermal Processing
EMS Tabletop Thermal Oxidation Furnace
EMS Tabletop Solid Source Doping Furnace
Allwin AW-610 M Rapid Thermal Processor
High Temperature Vacuum Tube Furnace
- Dicing and Bonding
Kulicke & Soffa I 5000 Wire Bonder
- Inspection and Characterization
Keyence VHX 7000 Digital Microscope
Zygo NewView 7100 Profilometer
Shimadzu Spectrophotometer UV-3101 UV-VIS-NIR
- Electrical Characterization
Keithley 4200A Semiconductor Analyzer
Signatone 4-pt Probe/Keithley 2400
- Integrated Packaging Lab in Arlington, VA
- Equipment for thin film, metal deposition, laser machining, metal plating, wire bonding, circuit board creation, flux-less vacuum solder reflow, and low-temperature-cofired-creamic (LTCC) tape processing.
- Electrical testing capabilities include low and high power curve tracers, dielectric measurement equipment, and magnetic property analyzers.
- Thermal evaluations can be made using thermocouples, fiberoptic sensors, IR imaging and thermal diffusivity tests.
- Reliability analysis is performed using temperature and humidity cycling chambers.