RIT Facilities
RIT Semiconductor Nanofabrication Lab
The RIT Semiconductor Nanofabrication Lab provides a complete toolset for 150mm CMOS processing within 10,000 sq. ft. of Class 1000 / ISO 6 cleanroom space configured in a bay-and-chase layout. Additional facilities include a Class 100 / ISO 5 laboratory, a dedicated MOCVD Growth Lab, and a comprehensive suite of test and characterization equipment.
Together, these capabilities support cutting-edge research, prototyping, and education in semiconductor devices, nanofabrication, and advanced materials.
Core Capabilities and Equipment
Chemical Vapor Deposition (CVD & ALD)
- Tystar Nitride and Poly deposition
- Ultratech ALD (alumina, hafnium oxides)
Dicing
- ADT Dicing Saw (silicon and ceramics)
Dry Etch
- Trion Phantom II RIE
- Trion Minilok
- Trion Phantom ICP
- Trion Apollo Asher
- LAM 490 Plasma Etcher
- STS ASE Deep Si Etcher
- Plasmatherm ICP Cl Etcher
- Xactix XeF₂ Etcher
Epitaxy
- Aixtron 3×2″ MOCVD system (see RIT EPICenter for details)
Lithography
- ASML 5000 i-line Stepper
- GCA g-line Stepper
- SUSS MA150 and MJB4 Contact Aligners
- SVG Coat and Develop Tracks
- Manual Spin Coaters
- Heidelberg Direct Write System
Metrology
- Tencor P2 Profilometer
- CDE Res Map
- Wyko Dynamic Profilometer
- Woollam VASE Ellipsometer
Plasma Enhanced CVD (PECVD)
- AME P5000 TEOS Deposition
- TRION PECVD
Physical Vapor Deposition (PVD)
- CHA E-beam Evaporation
- CVD Thermal Evaporation
- CHA Flash Evaporator
- CVC 601 Sputter Deposition
Thermal & Implant
- Bruce Furnace Tubes
- Tystar Oxidation Tube
- Varian 350D Implanter
Wet Chemical Processing
- MOS RCA Wet Bench
- Nitride and Hot Phos Wet Bench
- Aluminum Etch Bench
- Solvent Strip Wet Bench
Applications
- CMOS device prototyping and process development
- Advanced materials growth and integration
- MEMS and sensor fabrication
- Optoelectronic and photonic devices
- Training and workforce development