The 22 international students participating in the UPWARDS Summer Camp made the most of their two days with Virginia Tech in the greater Washington, D.C., area, programming drones and robots, learning about artificial intelligence chip design, and meeting with faculty, and talking with leaders from Tokyo Electron Limited. And that was before they took a […]

Workforce development has never been this clean! 😌 International students in the UPWARDS (University Partnership for Workforce Advancement and Research & Development in Semiconductors) Summer Camp explored the world of semiconductors through classroom instruction and hands-on experience in our cleanroom! 🥼 UPWARDS is funded by Micron Technology, Tokyo Electron (TEL), and the National Science Foundation […]

A key part of Boise State’s focus and the mission of the Microelectronics Education and Research Center (MERC) is creating immersive and impactful opportunities for students to learn about semiconductors and microelectronics. The UPWARDS for the Future partnership is a collaboration between 11 US and Japanese universities. Funded by the National Science Foundation,  Micron, and […]

As a partner in the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future Network, Rensselaer Polytechnic Institute is building international collaborations in the microelectronics arena. As part of this effort, RPI sent three engineering undergraduate students to Japan to participate in semiconductor-focused summer. The students selected to […]

As a partner in the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future Network, Rensselaer Polytechnic Institute is deepening research collaborations with Japan. Associate Professor Trevor Rhone, Department of Physics, Applied Physics, and Astronomy, traveled to Tohoku University in Japan on June 22-26, 2025. The purpose of […]

Article snippet taken from Boise State News – see full published article here “University, industry and government partners from the United States and Japan gathered in April 2025 at Boise State University to advance semiconductor and microelectronics education, work that is critical to making Idaho, Japan and the United States globally competitive. ‘The work we […]

RPI is a partner in the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future Network, a consortium of 11 universities in the U.S. and Japan. In November 2024, four members of RPI’s UPWARDS Steering Committee, Robert Hull, Vice President for Research, Shekhar Garde, Christian Wetzel, Professor of […]

Eleven universities, including Boise State, are forging international ties with the University Partnership for Workforce Advancement and Research and Development in Semiconductors for the Future (UPWARDS) program. UPWARDS is an international semiconductor program funded by Micron, Tokyo Electron, and the National Science Foundation. The UPWARDS program aims to empower the next generation of female engineers […]

HENRIETTA, N.Y. (WROC) — Since the passage of the federal CHIPS Act, New York has seen significant investment in the semiconductor industry from a recent $40 million into the 1-90 Semiconductor Highway to Micron’s future mega-fab near Syracuse. But this infrastructure needs workers, and an international exchange program between the US and Japan — started […]

Associate Professor Kurtis Cantley of Boise State University, a U.S. participant in UPWARDS, a semiconductor human resource development project involving 11 U.S. and Japanese universities including Hiroshima University (HU), visited the Higashi-Hiroshima Campus of HU. During his visit, Professor Cantley was guided by Professor Suguru Kameda of the Research Institute for Semiconductor Engineering on a […]

UPWARDS 11 University partners gathered at Purdue University for a whirlwind planning and organizing conference. Representatives from U.S. and Japanese Universities, alongside Micron, TEL, and the National Science Foundation, met to continue their critical work in expanding the semiconductor workforce in industry and academia. 

The University of Washington is at the forefront of an international effort to innovate the semiconductor industry while building a skilled U.S.-based workforce to design and manufacture chip technology. Part of a landmark education partnership that was announced in May 2023 at the G7 meeting in Japan, the effort brings together researchers and faculty from […]